Tlaletso Global Photonics (TGO) designs and manufactures laser diodes, VCSEL, DFB lasers, laser drivers, CDR circuits, optical modulators, TIAs, co-packaged optics, silicon photonics, linear drive plu...
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Reduce PCB defects with laser soldering! Discover how laser soldering enables micro-joining, compare the benefits with traditional methods, and explore key applications &
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The main purpose of this research project is to identify low-cost, high-yield, data-driven processes such as laser selective soldering and infra-red (IR) soldering to attach non-reflowable optoelectronic
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Soldering technique: The recommended soldering techniques are either reflow soldering with convection heating or vapor phase soldering, both of which require a preheating step.
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The technological features of laser soldering are presented for various types of contact connections in electronic modules, including bulk conductors, planar lead elements, chips, and
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In the present work, we analyzed the effect of Variable Irradiance Mask in a Focused Infrared Light Soldering System to obtain a specific size and shape irradiance and heat distribution of
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Dividing the larger die pads into smaller screen openings reduces the risk of solder voiding and allows the solder joints for the smaller terminal pads to be at the same height as the larger ones.
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At our company, we''ve solved this pain point by integrating selective wave soldering into LED automotive light module PCBA manufacturing, and it''s redefining efficiency, reliability, and cost
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In this video, I show you how to solder SMD LEDs safely without damaging them. You''ll learn:...more
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Wave soldering: Wave soldering is still widely employed for axial leaded devices and for mixed technology boards. Surface mount components can be wave soldered successfully if the
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At our company, we''ve solved this pain point by integrating selective wave soldering into LED automotive light module PCBA manufacturing, and it''s redefining efficiency, reliability, and cost
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Our research highlighted the importance of the soldering technology used and the thermal profile in the case of the assembly of IGBT components.
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The light emitting diode (LED) components and other integrated circuit packages are assembled to the boards by soldering. This chapter discusses two types of soldering methods, namely wave soldering
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When considering candidate selective soldering systems, the appropriate process controls should be examined to ensure optimal solderability. A well-defined protocol should be followed to evaluate and
View moreHigh-power CW/pulsed laser diodes (808nm–1550nm) and VCSEL arrays for 3D sensing, LIDAR, and optical interconnects.
Co-packaged optics engines, silicon photonics ICs, and optical I/O solutions for high-density switches and AI clusters.
400G/800G QSFP-DD/OSFP modules, active optical cables, and custom optical engines for data center interconnects.
Low-jitter laser drivers, integrated CDR circuits, and linear TIAs for coherent optics and short-reach links.
We provide custom laser diodes, VCSEL arrays, DFB lasers, drivers, CDR, modulators, TIAs, co-packaged optics, silicon photonics, LPO, transceivers, and AOCs.
From prototype to mass production, our team ensures premium quality and technical support.
23 Photonics Avenue, Techno Park, Stellenbosch, 7600, South Africa
+27 63 148 2975 | +27 63 148 2975 | [email protected]