Tlaletso Global Photonics (TGO) designs and manufactures laser diodes, VCSEL, DFB lasers, laser drivers, CDR circuits, optical modulators, TIAs, co-packaged optics, silicon photonics, linear drive plu...
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Capability for EMI/RFI resistance built in the structure. Unique profile for fixing any
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High quality 19" rackmount chassis platform consisting of pre-galvanized steel enclosures, PICMIG 2.16 or 2.17 backplane, power supply, redundant push/pull cooling system and AC/DC power components.
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Choose from a wide range of over 48,000 items, and with no purchase quantity requirements, you can simply purchase from 1 piece onwards!
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Benefit from our variety of high-performance electronics packaging solutions from 19” subracks, chassis, tabletop cases and front panels, designed to meet the diverse needs of industries such as military,
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ERack''s unique 19-inch chassis design is constructed from aluminum coated with Iridite Non-Chrome Passivation (NCP), delivering enhanced lightness and rigidity.
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Capability for EMI/RFI resistance built in the structure. Unique profile for fixing any needed accessory without taking space of 19-inch. Easy adoption for I/O panels and cooling systems.
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Designing a 19-inch rackmount enclosure involves key aspects like optimal space utilization, cooling solutions, and durability to ensure reliable and efficient performance in various
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19" subracks are used for housing plug-in circuit boards (e.g., 3U, 6U, 84HP) according to IEC 60297 and IEEE 1101.x. The construction is done using carrier frames with guide rails, rear panel, or
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Design in zinc plated steel, front panel in raw or brushed oxidised colourless aluminium of 4 mm thickness, allowing great modularity. Can be used with or without runners at high load capacity.
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This guide gives you a clear, practical overview of 19-inch industrial chassis design, the differences between steel and aluminium, key finishing methods, and what to consider when
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This Guide Explains Why Standardizing a 19 Inch Rack Mount Isn''t Necessarily a Bad Thing, As Well As How To Make The Most Of It. This Post Is An Overview Of How To Build a
View moreHigh-power CW/pulsed laser diodes (808nm–1550nm) and VCSEL arrays for 3D sensing, LIDAR, and optical interconnects.
Co-packaged optics engines, silicon photonics ICs, and optical I/O solutions for high-density switches and AI clusters.
400G/800G QSFP-DD/OSFP modules, active optical cables, and custom optical engines for data center interconnects.
Low-jitter laser drivers, integrated CDR circuits, and linear TIAs for coherent optics and short-reach links.
We provide custom laser diodes, VCSEL arrays, DFB lasers, drivers, CDR, modulators, TIAs, co-packaged optics, silicon photonics, LPO, transceivers, and AOCs.
From prototype to mass production, our team ensures premium quality and technical support.
23 Photonics Avenue, Techno Park, Stellenbosch, 7600, South Africa
+27 63 148 2975 | +27 63 148 2975 | [email protected]