Tlaletso Global Photonics (TGO) designs and manufactures laser diodes, VCSEL, DFB lasers, laser drivers, CDR circuits, optical modulators, TIAs, co-packaged optics, silicon photonics, linear drive plu...
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The Edgecore AIS1600-64O is a 64-port 1.6T AI switch powered by Broadcom Tomahawk 6. Delivering 102.4 Tbps capacity and sub-microsecond latency, it eliminates bandwidth bottlenecks for next-gen
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High-performance 1.6T AI fabric switch built on Broadcom Tomahawk 6, delivering 102.4 Tbps switching capacity with Adaptive Routing and congestion control for GPU-dense AI training clusters.
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Both groups have set out to define 800G and 1.6T over 224 Gb/s lanes. Here are several challenges and potential solutions for achieving 224 Gb/s lane rates. Faster networking switch chips
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Edgecore AIS1600-64O is an ultra-high-density 1.6T OSFP1600 switch built for next-generation AI, data center, and high-performance network environments that require extreme bandwidth and scalable
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An Aggregation or "Top-of-Rack" switch is designed to connect everything in a rack at high speeds, then have an even bigger pipe out to the rest of the network.
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Celestica DS6001 1.6T switch is a 2OU hybrid-cooled data center switch with 64×1.6T OSFP224 ports, Broadcom® Tomahawk® 6, and Intel® Xeon® CPU.
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Built for hyperscale AI/ML clusters, it enables high-radix scalability, advanced load balancing, and congestion management. Its 1.6T connectivity, efficient design, and telemetry features optimize
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Celestica DS6000 is a next-generation ultra-high-density 1.6T OSFP224 switch designed for the most demanding data center and AI network environments where maximum bandwidth, scalability, and
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Nokia 7250 IXR-6e, IXR-10e and IXR-18e are differentiated, modular platforms designed for data center spine, super-spine, aggregation and WAN deployments. These platforms deliver massive scalability,
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"The introduction of our new 1.6T switches marks a significant milestone for Celestica and our customers. The DS6000 and DS6001 represent a new era in high-performance networking,
View moreHigh-power CW/pulsed laser diodes (808nm–1550nm) and VCSEL arrays for 3D sensing, LIDAR, and optical interconnects.
Co-packaged optics engines, silicon photonics ICs, and optical I/O solutions for high-density switches and AI clusters.
400G/800G QSFP-DD/OSFP modules, active optical cables, and custom optical engines for data center interconnects.
Low-jitter laser drivers, integrated CDR circuits, and linear TIAs for coherent optics and short-reach links.
We provide custom laser diodes, VCSEL arrays, DFB lasers, drivers, CDR, modulators, TIAs, co-packaged optics, silicon photonics, LPO, transceivers, and AOCs.
From prototype to mass production, our team ensures premium quality and technical support.
23 Photonics Avenue, Techno Park, Stellenbosch, 7600, South Africa
+27 63 148 2975 | +27 63 148 2975 | [email protected]