Amidst the intensifying competition for AI computing power, five critical types of PCBs within AI servers—featuring up to 44 layers and necessitating specialised M9 materials—are increasingly beco...
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AI servers consume thousands of watts under heavy loads, generating immense heat. PCBs must employ high-thermal-conductivity materials (e.g., metal substrates, ceramic fillers) while
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PCB Materials for AI Data Centers and High-Performance Servers: MEGTRON Explained That was an incredibly thorough technical overview of why the Panasonic MEGTRON series has become the
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Explore 2026 market trends, high-frequency materials, the shift to AI server PCB, and how to choose the right manufacturer. The NVIDIA M10 test is driving a PCB industry revolution.
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High-frequency PCB and RF PCB solutions for aerospace, medical, and industrial applications. As Artificial Intelligence rapidly advances, the training of large models and edge
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Amidst the intensifying competition for AI computing power, five critical types of PCBs within AI servers—featuring up to 44 layers and necessitating specialised M9 materials—are increasingly
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Between 2024 and 2026, the TIM materials ecosystem for AI servers moved from incremental thermal-interface improvements toward platform-level solutions tuned for the next
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Next-generation AI servers aren''t just heavier on layer counts. They demand better materials to handle the speed, heat, and signal integrity requirements of 400G, 800G, and even 1.6T
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This article will begin with an overview of the current AI boom, and go on to explore in depth the characteristics of server PCB substrates, existing supply bottlenecks, and feasible
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The average AI server PCB layer count rose from 18 in 2023 to 32 in 2025 — a 78% increase in just two years. On March 13, 2026, supply chain analyst Guo Mingqi confirmed that NVIDIA and Wus Printed
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As the AI boom reshapes global supply chains, materials have become the new geopolitical and economic leverage point. Taiwan''s PCB and CCL ecosystem, long known for its cost
View moreHigh-power CW/pulsed laser diodes (808nm–1550nm) and VCSEL arrays for 3D sensing, LIDAR, and optical interconnects.
Co-packaged optics engines, silicon photonics ICs, and optical I/O solutions for high-density switches and AI clusters.
400G/800G QSFP-DD/OSFP modules, active optical cables, and custom optical engines for data center interconnects.
Low-jitter laser drivers, integrated CDR circuits, and linear TIAs for coherent optics and short-reach links.
We provide custom laser diodes, VCSEL arrays, DFB lasers, drivers, CDR, modulators, TIAs, co-packaged optics, silicon photonics, LPO, transceivers, and AOCs.
From prototype to mass production, our team ensures premium quality and technical support.
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