Tlaletso Global Photonics (TGO) designs and manufactures laser diodes, VCSEL, DFB lasers, laser drivers, CDR circuits, optical modulators, TIAs, co-packaged optics, silicon photonics, linear drive plu...
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The utility model discloses and belongs to the technical field of electric power fittings. The utility model relates to a power distribution cabinet, in particular to a high-heat-dissipation high-voltage power
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In this way, the heat of the heat source can be stably and efficiently conducted to the heat transfer block, thereby increasing the heat dissipation capacity and heat dissipation efficiency of the heat source
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When the heat dissipation inside the high-voltage distribution box is inefficient, operation in such an environment for a long time impairs the service life of components such as a relay and a
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As well as power loss, the rise in temperature of the diodes may also be concerning. Because the temperatures may rise more than one would like there is a need for dissipating the heat
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The variable plates herein are inclined to the balloons so as to enlarge the area of the heat dissipation holes, the speed of the fans is increased, the heat dissipation passages are added, heat is dissipated
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A power distribution box with good heat dissipation includes a box body, a box door is rotatably connected to the box body, and a fan and a heat dissipation window are arranged on the...
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The present invention increases heat conduction of the thermal energy generated by the plurality of electronic circuit boards to the housing, thereby preventing circuit board damage.
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A heat dissipation device and heat dissipation box technology, which is applied in the cooling/ventilation of substation/switchgear, substation/power distribution device shell, electrical components, etc., and
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In view of the shortcomings of the prior art, the purpose of the present patent is to provide a ventilation and heat dissipation box-type substation, which has the effect of avoiding heat
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The heat dissipating structure (550) applies a force to the thermal pad (555) that presses the thermal pad (555) toward the pin (535) or the shroud (545). A PDU (100) having an input module...
View moreHigh-power CW/pulsed laser diodes (808nm–1550nm) and VCSEL arrays for 3D sensing, LIDAR, and optical interconnects.
Co-packaged optics engines, silicon photonics ICs, and optical I/O solutions for high-density switches and AI clusters.
400G/800G QSFP-DD/OSFP modules, active optical cables, and custom optical engines for data center interconnects.
Low-jitter laser drivers, integrated CDR circuits, and linear TIAs for coherent optics and short-reach links.
We provide custom laser diodes, VCSEL arrays, DFB lasers, drivers, CDR, modulators, TIAs, co-packaged optics, silicon photonics, LPO, transceivers, and AOCs.
From prototype to mass production, our team ensures premium quality and technical support.
23 Photonics Avenue, Techno Park, Stellenbosch, 7600, South Africa
+27 63 148 2975 | +27 63 148 2975 | [email protected]