The process involves illuminating an intense pulse of light onto a very thin light-absorbing layer (LAL) through the glass substrate for a few hundred microseconds. The LAL absorbs the light, converti...
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Fiber tapping is a network tap method that extracts signal from an optical fiber without breaking the connection. Tapping of optical fiber entails diverting some of the signal being transmitted in the core
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The most common debonding methods are thermal slide-off debonding, mechanical debonding and UV laser debonding. These three methods are all in high- volume manufacturing and differ strongly in
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However, the mechanics at the fiber-package interface remain unclear when debonding occurs. This paper investigates the interfacial mechanics for distributed fiber optic sensors
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After the wafers have been bonded the bond quality needs to be confirmed. There are several options available including scanning acoustic microscopy (Example 1) or full field optical inspection such as
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Laser debonding offers several advantages such as precision, speed, minimal damage, and being noncontact. We investigated the feasibility of utilizing laser processing technology in producing high
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Among the five debonding methods, photonic debonding proves to be most favorable in processes that require precision, such as wafer thinning and dicing. There are many benefits that
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Laser debonding requires the formation of a thin long line, typically achieved by using large, complex, and expensive cylindrical optics. This article presents an alternative approach
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By delivering a stress-free, rapid, and contamination-free debonding process, photonic debonding enhances process reliability and enables advanced
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Fiber-matrix debonding is a precursor for transverse cracking and several other types of damage in fiber composites. However, to date, there are limited experiment-based reports that study
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Suitable for wafer-level and panel-level packaging, PulseForge Photonic Debonding offers ash-free wafer separation with fewer contaminants and lower cost compared to lasers. It can also be used on
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By delivering a stress-free, rapid, and contamination-free debonding process, photonic debonding enhances process reliability and enables advanced packaging applications such as 3DHI,
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View moreHigh-power CW/pulsed laser diodes (808nm–1550nm) and VCSEL arrays for 3D sensing, LIDAR, and optical interconnects.
Co-packaged optics engines, silicon photonics ICs, and optical I/O solutions for high-density switches and AI clusters.
400G/800G QSFP-DD/OSFP modules, active optical cables, and custom optical engines for data center interconnects.
Low-jitter laser drivers, integrated CDR circuits, and linear TIAs for coherent optics and short-reach links.
We provide custom laser diodes, VCSEL arrays, DFB lasers, drivers, CDR, modulators, TIAs, co-packaged optics, silicon photonics, LPO, transceivers, and AOCs.
From prototype to mass production, our team ensures premium quality and technical support.
23 Photonics Avenue, Techno Park, Stellenbosch, 7600, South Africa
+27 63 148 2975 | +27 63 148 2975 | +86 138 2753 9641 | +86 138 2753 9641 | [email protected]