Take lighter cuts when grinding. Radial Break, 3 or More Pieces. Flanges pulled up unevenly causing side strains on wheel. Use only standard paper or blotting paper gaskets. CNC machining defects are ...
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Increase chip load to carry away heat. Use cutter with chip gullets large enough for chip clearance. Use air blast or coolant to remove chips.
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Unlock the secrets to overcoming the “pigtail effect” in stainless steel guidewire and corewire grinding with our comprehensive white paper. Dive into industry-leading solutions to optimize your
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In this guide, we will delve into the intricacies of CNC end face grinders, exploring their key features such as grinding diameter, spindle speed, and feed speed, and how these specifications
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This study examines how cutting forces impact the formation of cracks and chips on surfaces during the grinding of products. Understanding the structure of the grinding process is
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In this article, we summarize the most common cutting tool grinding defects, analyze their root causes, and provide practical solutions based on real production experience.
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This can be caused by a variety of factors, including a wheel that is too soft, uneven travel past each end of the hole, or tipped workhead. To correct this issue, it may be necessary to
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Consequently, consultations on chipping-related issues are on the rise. In this article, we will explore why chipping occurs on the work material during grinding with diamond wheels. We will
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Consequently, consultations on chipping-related issues are on the rise. In this article, we will explore why chipping occurs on the work material
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The following indications suggest the possibility of machining defects caused by chipping. Frequently stopping or experiencing unexpected downtime of the CNC machining process.
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Below, are listed problems, which may be encountered whilst grinding. Under each are listed probable causes, and under each cause, possible corrections. Possible corrections are used advisedly here. It
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We investigate why chipping or damage might occur at the leading edge of parts upon entry and offer preventative solutions.
View moreHigh-power CW/pulsed laser diodes (808nm–1550nm) and VCSEL arrays for 3D sensing, LIDAR, and optical interconnects.
Co-packaged optics engines, silicon photonics ICs, and optical I/O solutions for high-density switches and AI clusters.
400G/800G QSFP-DD/OSFP modules, active optical cables, and custom optical engines for data center interconnects.
Low-jitter laser drivers, integrated CDR circuits, and linear TIAs for coherent optics and short-reach links.
We provide custom laser diodes, VCSEL arrays, DFB lasers, drivers, CDR, modulators, TIAs, co-packaged optics, silicon photonics, LPO, transceivers, and AOCs.
From prototype to mass production, our team ensures premium quality and technical support.
23 Photonics Avenue, Techno Park, Stellenbosch, 7600, South Africa
+27 63 148 2975 | +27 63 148 2975 | +86 138 2753 9641 | +86 138 2753 9641 | [email protected]