Co-Packaged Optics (CPO) technology, as a key technology in the field of optical interconnects, improves transmission bandwidth and reduces energy consumption by shortening electrical transmission dis...
Contact online >>
Ansys Lumerical and Zemax toolsets provide the best-in-class solutions to simulate and design complete optical coupling systems for co-packaged optics and other integrated photonics applications.
View more
Network-level: Micro-second optical circuit switching networks Package-level: Co-processing on the CPO HBM memory access & controller
View more
CPO, a technology that deeply co-packages the optical engine with the switch chip, offers a solution for next-generation AI cluster interconnects by
View more
The optical engine of a transceiver — whether co-packaged or part of a pluggable module — typically includes an electronic integrated circuit (EIC) and photonic integrated circuits (PICs).
View more
Abstract: Generative artificial intelligence (GAI) and Large Language Model (LLM) require data center to have higher bandwidth, and better energy efficiency. To achieve this, Co-packaged optics (CPO) is
View more
CPO enhances interconnect bandwidth and energy efficiency by integrating optics and electronics within a single package, significantly shortening electrical link lengths. This innovation is
View more
Co-packaged optics (CPO) technology offers a promising solution by integrating photonic integrated circuits (PICs) directly within or close to electronic integrated circuit (EIC) packages.
View more
Co-Packaged Optics (CPO) is a technology and design approach where optical components, such as lasers and photodetectors, are integrated alongside electrical components, like Application-Specific
View more
A co-packaged optic module design was developed to support electronic and optics compatibility, industry standards where applicable and scaling for design, process, assembly, test, pluggable
View more
This paper gives a brief overview of state-of-the-art of co-packaged optical I/O and requirements of its next generations. We also discuss ideas to exploit co-packaged optics in disaggregated AI systems
View more
As an alternative to traditional pluggable optical modules, the standardization of CPO''s packaging technology and form factor is crucial for the development of the industrial ecosystem.
View more
By minimizing the length of ASIC-to-optics interconnects, co-packaged and near-package optical (CPO/NPO) implementations significantly reduce power
View moreHigh-power CW/pulsed laser diodes (808nm–1550nm) and VCSEL arrays for 3D sensing, LIDAR, and optical interconnects.
Co-packaged optics engines, silicon photonics ICs, and optical I/O solutions for high-density switches and AI clusters.
400G/800G QSFP-DD/OSFP modules, active optical cables, and custom optical engines for data center interconnects.
Low-jitter laser drivers, integrated CDR circuits, and linear TIAs for coherent optics and short-reach links.
We provide custom laser diodes, VCSEL arrays, DFB lasers, drivers, CDR, modulators, TIAs, co-packaged optics, silicon photonics, LPO, transceivers, and AOCs.
From prototype to mass production, our team ensures premium quality and technical support.
23 Photonics Avenue, Techno Park, Stellenbosch, 7600, South Africa
+27 63 148 2975 | +27 63 148 2975 | +86 138 2753 9641 | +86 138 2753 9641 | [email protected]